Organizado por la Cátedra USECHIP en colaboración con ALTER Technology
Fecha: 7-8 de mayo de 2026 de 9:30 a 13:30 horas.
Modalidad PRESENCIAL exclusivamente. Idioma: Inglés.
Lugar: Salón de Grados del Instituto de Microelectrónica de Sevilla, Avda. Americo Vespucio, 28. Sevilla
Profesorado: Dr. Karl-Friedrich Becker, Dr. Hans Walter y Dr. Tekfouy Lim. (Fraunhofer IZM)
Registro: Gratuito.
Imprescindible solicitar plaza en el formulario abajo antes del 1 de mayo de 2026.
Admisión condicionada a disponibilidad de aforo. Se confirmará la misma mediante correo electrónico.
Breve descripción de contenidos
Introduction to packaging (development of electronics packaging; technology waves from THT via Flip Chip towards 3D integration; Building Blocks for electronics packaging; Wire Bonding, Component Placement, Soldering, Encapsulation, …)
Materials for Packaging (Overview of used Materials in Package Applications: Metals, Semiconductor, Polymers, Ceramics …; Load Conditions: Process, intrinsic Load, Environment, Mechanical, Thermal …)
System Design (Co-design workflow across chip, package, and board; Core trade-offs (performance, energy, cost, reliability, size/thermal); Key standards (e.g., UCIe) and design kits (PDK/ADK)
System Technology Co-Optimization (STCO vs DTCO; Recognize key STCO building blocks (chiplets, 2.5D/3D, interposers, HBM, CPO); STCO workflows (PDK/ADK, multi‑physics modeling, KPIs); Trade‑offs (performance, energy, cost, reliability))
Process development (Assembling a Chiplet Module: discussing an assembly process development; Technology & process flow selection / Scalability; Boundary conditions of substrate procurement; Assembly Process – Machine Capabilities & related options; Encapsulation – Material selection & process evaluation; Balling – Ball Drop vs. Ball Jet (SB²) vs. Wagenbrett; Device Analysis & Inspection / Test Planning / Reporting)
Challenges and Requirements for Reliability (Introduction, Terminology, statistical Parameters (Bathtub Curve, Weibull Distribution); Failure Modes and Failure Mechanisms in Advanced Packaging; Lifetime Models (Arrhenius, Coffin Manson); Simulation Approach
Special Applications: RF, high speed, Space (Understand co-design trade-offs (performance, energy, reliability, cost, size); RF focus (mmWave/5G, radar): AiP/SiP, III-V ICs (GaN/InP), embedding PCB; High-speed focus: co‑packaged optics (CPO) interposers (Si/organic/glass); Space focus: electronics in textile, hermetic encapsulation, Satellite communication)
Aspects of Sustainability (Introduction, Terminology, Parameters; Climate relevant Emission and others: Focus Product Carbon Footprint (PCF); Life cycle Assessment LCA): Quantifying of Environmental impact – Life Cycle, Methodology, Example Analysis of PCF)
Por la tarde habrá demostraciones prácticas complementarias en Alter Technologies, pero debido al estricto aforo de sus laboratorios, serán exclusivamente por invitación.
